Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology
PITTSBURGH, Feb. 22, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) and Intel Foundry collaborated to provide multiphysics signoff solutions for Intel's innovative 2.5D chip assembly technology, which uses ...
How an integrated chip–package co-analysis can quickly and accurately model package layout for inclusion in on-chip power integrity simulations. Ansys RedHawk-CPA is an integrated chip–package ...
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